International Association of Building Physics

International Association of Building Physics (IABP) 2018 Summer School

The next IABP Summer School will be organized on September 21st – 23rd , 2018 at Syracuse University, Syracuse, NY 13244-1240, USA.

The event will take place just before the IBPC 2018 International Conference.


Title: Coupled Heat, Air, Moisture and Pollutant Simulations in Built Environment Systems (CHAMPS-BES): Modeling VOC Emissions and Sorption of Building Materials

Course description: The course is intended for Ph.D. and M.S. students with prior knowledge of undergraduate levels of heat and mass transfer. It provides an in-depth discussion of the fundamental mechanisms and processes involved in the emissions of volatile organic compounds (VOCs) from building materials and indoor furnishings.


  • VOC emission and sorption characteristics of building materials and indoor furnishings and major influencing factors: Chamber testing methods and results for “wet” coating, installation and dry materials, Mechanistic model-based testing and evaluation: principles and applications.
  • A Mechanistic model for coupled heat, air, moisture and pollutant simulations: Fundamentals, Modeling and simulation with CHAMPS-BES/Delphin5
  • Material properties for heat, air, moisture and pollutant transfer and storage: a microscopic view and methods of determination: Microscopic structure of materials and impacts on transport and storage properties, Methods for the determination of the mechanistic model parameters
  • Computer simulation lab and experiments: Modeling and simulation case studies in groups, Small and full chamber testing lab – Group experiments

Total contact hours: 15 hours, 2.5 days

Number of participants: 15-30

Course fees: $150 (including a USB containing the course presentations, reference materials and software to be used)

Registration: Please register via the IBPC2018 website and select the “IABP Graduate Course”

Contact: Dr. Meng Kong, BEESL, Department of Mechanical and Aerospace Engineering, College of Engineering and Computer Science, Syracuse University. Email: mkong01@syr.edu.